- Encapsulacion (Electronica)
Entrada Topical Term
Número de registros utilizados en: 0
001 - CONTROL NUMBER
- control field: 56199
003 - CONTROL NUMBER IDENTIFIER
- control field: OSt
005 - DATE AND TIME OF LATEST TRANSACTION
- control field: 20180529115935.0
008 - FIXED-LENGTH DATA ELEMENTS
- fixed length control field: 860211i| anannbabn |a ana
040 ## - CATALOGING SOURCE
- Original cataloging agency: la-la
042 ## - AUTHENTICATION CODE
- Authentication code: la
083 ## - DEWEY DECIMAL CLASSIFICATION NUMBER
- Classification number element--single number or beginning number of span: 621.381046-20 ed.
150 ## - HEADING--TOPICAL TERM
- Topical term or geographic name entry element: Encapsulacion (Electronica)
450 ## - SEE FROM TRACING--TOPICAL TERM
- Topical term or geographic name entry element: Componentes electrónicos-Revestimientos
450 ## - SEE FROM TRACING--TOPICAL TERM
- Topical term or geographic name entry element: Encapsulado plástico (electrónica)
550 ## - SEE ALSO FROM TRACING--TOPICAL TERM
- Control subfield: g
- Topical term or geographic name entry element: Aisladores electricos de plastico
550 ## - SEE ALSO FROM TRACING--TOPICAL TERM
- Control subfield: g
- Topical term or geographic name entry element: Electronica-materiales
550 ## - SEE ALSO FROM TRACING--TOPICAL TERM
- Control subfield: g
- Topical term or geographic name entry element: Encapsulado electronico
550 ## - SEE ALSO FROM TRACING--TOPICAL TERM
- Control subfield: g
- Topical term or geographic name entry element: Plasticos
550 ## - SEE ALSO FROM TRACING--TOPICAL TERM
- Control subfield: g
- Topical term or geographic name entry element: Revestimientos plasticos
670 ## - SOURCE DATA FOUND
- Source citation: LEMB
670 ## - SOURCE DATA FOUND
- Source citation: Library of Congress. CDMARC subjects, diciembre 1996 ; Lista de encabezamientos de materia de la Red de Bibliotecas del CSIC. Madrid : CSIC, 1995 ; Diccionario de términos científicos y técnicos. Barcelona : Marcombo, McGraw Hi
680 ## - PUBLIC GENERAL NOTE
- Heading or subdivision term: Usase para referirse al proceso de llenar un conjunto electrónico completo con un compuesto termoestable para darle resistencia al choque y a la vibración, y para la exclusión de la humedad y los agentes corrosivos.
750 ## - ESTABLISHED HEADING LINKING ENTRY--TOPICAL TERM
- Topical term or geographic name entry element: Electronic apparatus and appliances--plastic embedment
750 ## - ESTABLISHED HEADING LINKING ENTRY--TOPICAL TERM
- Topical term or geographic name entry element: Potting